Application forms may be obtained:
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- from all Hong Leong Bank Berhad branches in Malaysia during banking hours
- by downloading from here.
- by sending a stamped (50 sen) self-addressed envelope to :
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Hong Leong Foundation Scholarship Programme
Level 8, Wisma Hong Leong
18 Jalan Perak
50450 Kuala Lumpur
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* Date for submission of application is 18 April 2008
* Only shorlisted candidates will be notified for an interview.
Incomplete and late applications will not be considered. |
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